vti_encoding:SR|utf8-nl vti_timelastmodified:TR|22 Jun 2020 18:16:16 -0000 vti_extenderversion:SR|12.0.0.0 vti_author:SR|DYTBDP1\\jclarkLCI vti_modifiedby:SR|DYTBDP1\\jclarkLCI vti_timecreated:TR|22 Jun 2020 18:16:16 -0000 vti_cacheddtm:TX|22 Jun 2020 18:16:16 -0000 vti_filesize:IR|7943 vti_cachedtitle:SR|Semiconductor die attach, solder fusion, sealing & encapsulation vti_cachedbodystyle:SR| vti_cachedlinkinfo:VX|X|http://html5shiv.googlecode.com/svn/trunk/html5.js X|http://css3-mediaqueries-js.googlecode.com/svn/trunk/css3-mediaqueries.js Q|../css/n.style.css Q|../css/n.img.css Q|../css/n.tables.css Q|../css/n.pro_dropdown.css Q|../css/n.query.css X|../css/lt7.css S|../css/stuHover.js S|../css/dropdown.js S|scripts/ganalytics.js I|../includes/inc_n.headerphone.php I|../includes/inc_n.navigation.php S|../images/applications/img_semicond-med.jpg H|http://www.henkel.com/electronics H|../Furnaces/S-Series.php K|../Furnaces/furnaces.php K|../Furnaces/furnaces.php K|../Furnaces/furnaces.php H|../Furnaces/furnaces.php H|../Features/standard_features_A-B.php I|../includes/inc_n.footer.php vti_cachedsvcrellinks:VX|NXHS|http://html5shiv.googlecode.com/svn/trunk/html5.js NXHS|http://css3-mediaqueries-js.googlecode.com/svn/trunk/css3-mediaqueries.js FQUS|css/n.style.css FQUS|css/n.img.css FQUS|css/n.tables.css FQUS|css/n.pro_dropdown.css FQUS|css/n.query.css FXUS|css/lt7.css FSUS|css/stuHover.js FSUS|css/dropdown.js NSUS|Applications/scripts/ganalytics.js FIUS|includes/inc_n.headerphone.php FIUS|includes/inc_n.navigation.php FSUS|images/applications/img_semicond-med.jpg NHHS|http://www.henkel.com/electronics FHUS|Furnaces/S-Series.php FHUS|Furnaces/furnaces.php FHUS|Furnaces/furnaces.php FHUS|Furnaces/furnaces.php FHUS|Furnaces/furnaces.php FHUS|Features/standard_features_A-B.php FIUS|includes/inc_n.footer.php vti_cachedneedsrewrite:BR|true vti_cachedhasbots:BR|true vti_cachedhastheme:BR|false vti_cachedhasborder:BR|false vti_metatags:VR|viewport width=device-width,\\ initial-scale=1 description Semiconductor\\ processing\\ application\\ requirements\\ for\\ near-infrared\\ production\\ belt\\ furnaces. keywords NIR\\ near-IR\\ IR\\ infrared\\ production\\ conveyor\\ belt\\ furnace\\ die\\ attach\\ curing\\ sealing\\ chip\\ package\\ packaging\\ oven\\ kiln\\ lead\\ lead-free HTTP-EQUIV=Content-Language en-us HTTP-EQUIV=Content-Type text/html;\\ charset=utf-8 description Semiconductor\\ processing\\ application\\ requirements\\ for\\ near-infrared\\ production\\ belt\\ furnaces. keywords NIR\\ near-IR\\ IR\\ infrared\\ production\\ conveyor\\ belt\\ furnace\\ die\\ attach\\ curing\\ sealing\\ chip\\ package\\ packaging\\ oven\\ kiln\\ lead\\ lead-free author James\\ Clark vti_charset:SR|utf-8 vti_language:SR|en-us vti_title:SR|Semiconductor die attach, solder fusion, sealing & encapsulation vti_backlinkinfo:VX|